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Product features：
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Laminating process fast and simple；
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Rigid and flexible material can do；
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Preset a variety of stitching program and set stitching program freely；
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Small volume, light weight, suitable for laboratory use；
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Produce 8 planes of printed circuit board at most, copper clad laminated plate, copper foil resin fiber board and bakelite laminated plate；
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Connected to computer USB interface, intuitively display temperature, pressure and time curve.
Product parameters：
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Maximum wiring size
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285 mm x 205 mm
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Maximum laminating area
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305 mm x 229 mm
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Maximum laminating pressure
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300N/cm2（20 ton）
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Highest temperature
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300℃
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PCB layer number
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8 layers（related to materials and design）
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Laminating time
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About 90 min
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Size（X/Y/Z）
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530 mm x 480 mm x 600 mm
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Weight
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180kg
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Power supply
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220V / 50Hz / 2.1KW
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Pressure unit size
（X/Y/Z）
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700 mm x 150 mm x 180 mm
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Substrate materials
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FR4, other materials according to the demands
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